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ECBA

Hong Kong 34th International Conference on “Engineering & Technology, Computer, Basic & Applied Sciences” (ECBA- 2018) May 12-13, 2018 Hongkong

Hong Kong, Hong Kong
12 May 2018
The conference ended on 12 May 2018

Important Dates

Early Bird Deadline
22nd April 2018
Abstract Submission Deadline
2nd May 2018
Final Abstract / Full Paper Deadline
2nd May 2018

About ECBA

“Advances in collaboration for Engineering & Technology, Computer, Basic and Applied Sciences Research & Practice” The conference will cover vital issues in Engineering & Technology, Computer, Basic and Applied Sciences Research & Practice under multiple sub-themes. The aim of our conference is to support, encourage and provide a platform for networking, sharing, publishing and nurturing the potential growth of individual scholars across the globe.

Topics

Automotive engineering, Biomedical engineering, Electrical and computer engineering, Electronic engineering, Electronics and telecommunications engineering, Genetic engineering, Industrial engineering, Mechatronics, Quantum mechanics

Call for Papers

ECBA-2018 Hong Kong conference is a premier platform for the presentation of novel and creative research results in the fields of theoretical, and applied Engineering & Technology, Computer and Information Technology, Basic and Applied Sciences. The conference will bring together leading researchers, social workers, scientists, and students in the domain of scientific interest from around the world.

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