REIMA
International Conference on Recent Advances in Engineering, Image Processing, Manufacturing & Applied Sciences 2018
Osaka, Japan
21 - 22 November 2018
The conference ended on 22 November 2018
Important Dates
Early Bird Deadline
11th November 2018
Abstract Submission Deadline
14th November 2018
About REIMA
Forum for enhancement of research and developmental activities through networking and sharing ideas.
Topics
Automotive engineering, Biomedical engineering, Electrical and computer engineering, Electronic engineering, Electronics and telecommunications engineering, Foundation engineering, Genetic engineering, Geotechnical engineering, Industrial engineering, Reaction engineering, Semiconductor engineeringCall for Papers
Research papers related to all areas of Engineering, Technology, Applied Sciences, Computer Science, Electrical and Mechanical Engineering, Chemical and Mechanical Engineering, Information Technology and Telecommunication etc are invited for the above international conference which is expected to be attended by the authors from various countries. People without papers can also participate in this conference.
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